The Widely Used of Thermal Materials Products

AOK has the capability to compound different primer for different material bonding application


简体| 繁體 | English | Deutsch | Italiano
You Are Here:Home > Application

    Many Applications Call for TIMs

    Our thermal interface materials  engineers notes, "Up to 99% of the surfaces are separated by a layer of interstitial air...a poor conductor of heat". Another major manufacturer cites that two "mating surfaces may touch over only 1/10,000 of their surfaces. They may touch at only three points. Everywhere else is a air between them, forming a thermal barrier."

    To be effective, all cold plates require intimate surface-to-surface contact with the component or board-to-be-cooled. Some type of thermally conductive interface material is necessary to fill the interstices between the mating surfaces. Moreover, to ensure that electrical problems are not inadvertently introduced while solving the thermal problems, it is often essential that these same thermal interface materials simultaneously perform an electrical isolation function. Everywhere else is a air between them, forming a thermal barrier.

    AOK is a Manufacturer of thermal interface materials offer a wide variety of products to suit the requirements of many different thermal management applications. These materials vary widely in terms of their performance (i.e., thermal, electrical, and physical properties), their general appearance, and their mode of application. Among the most commonly used classes of thermal interface materials are: thermal greases, cure-in-place thermally conductive compounds, gap filling thermally conductive elastomeric pads, thermally conductive adhesive tapes, and phase change materials.

    The gel-like sheet compound is designed to efficiently transfer heat from its source to the nearby heat sink.  The unique physical properties of this material allow it to protect delicate board-level components as they fill unwanted air gaps and levels uneven surfaces.

    thermal interface materials in electronic industries

    Major in the heat transfer application for electronic and LED products

    This high-performance silicone based compound is available in nine thicknesses that deliver a thermal conductivity of 1.0W/m*K to 5.0W/m*k. The TP series thermal pad is available in pre-cut sheets up to 200mm x 300mm or die-cut to your exact application specifications. In addition to growing LED lighting applications, the same thermal interface material has proven successful in helping cool power control units, converters, inverters and batteries.   As electronic packaging becomes more technologically advanced, the need for proper cooling of electronic components grows exponentially. AOK thermal interface materials are a cooling influence you can count on.

    Highly Conformable, Thermally Conductive Gap Fillers


    Shown below are just a few of the extensive and varied ways in which thermal gap filler materials have solved difficult heat transfer problems

    used for cooling PCBs

    conducting heat to a cast finned case

    AOK technical service staff can help engineers determine the appropriate materials for their application and heat transfer requirements.

    Thermal management challenge? Take the first step towards the solution for you. Please contact a AOK technical representative or e-mail for more information.

Copyright © 2004-2013 Shenzhen Aochuan Technology Co.,Ltd. All Rights Reserved. E-mail: