Not Just a Thermal Interface Material Factory, Your Complete Thermal Management Solution

Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. Over the last several years hundreds of major electronics manufacturers have expanded their use of LED lighting to enhance both product appearance and functionality. Recent design trends have integrated LED lighting packages in thousands of consumer and industrial electronic platforms that range from aircraft landing systems to automotive headlights and complex industrial control panels.

Best Services and Professional Custom Solutions

Global capabilities to help you meet your business objectives You know AOK as a global supplier of silicon-based chemicals. We can assist you in ways that extend far beyond materials... We offer services and solutions you would never have expected from a materials supplier.

Let us put our innovative thinking to work for you. Together, we can achieve things never before imagined. One of the most challenging issues with the use of LEDs is the control of unwanted heat. The most common way to dissipate this performance-hindering byproduct is to connect the LED package directly to a heat sink. To maximize the cooling performance of the heatsink, AOK offers its line extremely soft TP series thermal interface materials.

The gel-like sheet compound is designed to efficiently transfer heat from its source to the nearby heat sink.  The unique physical properties of this material allow it to protect delicate board-level components as they fill unwanted air gaps and levels uneven surfaces. This high-performance silicone based compound is available in nine thicknesses that deliver a thermal conductivity of 1.0W/m*K to 5.0W/m*k. The TP series thermal pad is available in pre-cut sheets up to 200mm x 300mm or die-cut to your exact application specifications. In addition to growing LED lighting applications, the same thermal interface material has proven successful in helping cool power control units, converters, inverters and batteries. 

As electronic packaging becomes more technologically advanced, the need for proper cooling of electronic components grows exponentially. AOK thermal interface materials are a cooling influence you can count on.

Gap fillers, gap pads, phase change materials, dispensed greases and gels, silicone-free thermal pads and insulator pads
Thermal compounds and flexible heat spreaders
Polymer solder hybrids and custom integrated thermal assemblies

Thermal management filler materials also provide effective heat-absorption solutions.

We are committed to understand your unique needs for materials in your product and for your process. No company offers a wider selection of thermal interface materials to meet your needs. Our decades of application knowledge are the core values we bring to your company, tap into this knowledge-base by calling one of our certified engineers at 0086-755-29765771 or email us.