Electronic products' heat conduction design as specified science has succeeded in heat dissipation and heat maintaining. In designing, heat conduction between power device and heat sink should be taken into consideration. To choose a good medium of heat transfer, not only its transmission capacity but its workmanship, operability and excellent cost performance should be considered. Thermal Conductive pad is designed to meet requirement of equipments' heat conduction, which proves to be excellent and reliable. It adapts to different environment and has appropriate solutions to problems which may occur in heat transfer. It contributes to highly integrated products and ultra-tiny products. Nowadays, more and more thermal conductive pads are applied to the products to improve their reliability and working life.

As for different electronic products, buyers are to choose thermal conductive materials according to their thermal conductivity instead of practical application. As a result, some illegal dealers offer false thermal conductivity to elevate their products' heat-conducting property since some buyers do not have detective equipments. Their products may work well in the first place, but they can not meet the requirement of heat conduction for a long time, which will damage the image of the companies and bring about serious problem to them.

Thermal conductivity as 1.5w/mk can meet the requirement of products' heat conduction whose heating power is 10w to 20w. Of course, products' applied environment, range of temperature, size and thickness are to be considered. When purchasing thermal conductive materials, buyers are suggested to purchase from companies with qualifications and can require a sample test and sign a sample acknowledgement, in which case buyers can have a guarantee about the quality of products and their reliability.

The choice of a TIM for a particular application involves the consideration of various factors, of which performance, manufacturability, and cost are primary ones. Desirable TIM characteristics include:

• Low in situ thermal resistance: high bulk thermal conductivity; ability to achieve low BLTs under actual assembly conditions; and low interfacial thermal resistances when applied between actual (end use) surfaces.
• Adequate adhesion if structural support is required.
• The ability to maintain thermal and mechanical performance throughout the life of the device.
• Easy to process in a manufacturing environment.
• Other factors such as low volatiles, dielectric properties, storage conditions, shelf life, pot life, toxicity, etc.

The TIM layers between a chip and a heat spreader and between a heat spreader and a heat sink are critical to the performance and reliability of microelectronic devices. A thorough understanding of the performance metrics, factors that affect the performance of a TIM, and the techniques to enhance the performance of a TIM layer can facilitate the selection of the right material solution for your cooling problem. It also is important to select a material that meets your requirements, not only when it is first used in a device, but throughout the life of the device.The TIM layers between a chip and a heat spreader and between a heat spreader and a heat sink are critical to the performance and reliability of microelectronic devices. A thorough understanding of the performance metrics, factors that affect the performance of a TIM, and the techniques to enhance the performance of a TIM layer can facilitate the selection of the right material solution for your cooling problem. It also is important to select a material that meets your requirements, not only when it is first used in a device, but throughout the life of the device.