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So far, LED is the new generation of solid state light emitter. It has advantages as follows: long working life, energy-efficient and environmental friendly, and it is largely used in lighting field. With the development of technology, advanced technology is applied to semiconductor production to promote luminous efficiency and lower cost. Now, Shenzhen Aochuan Technology Co., Ltd. will introduce to you about LED lighting's structure of heat transfer and analysis of principles

LED's core part is PN junction. When injected electron and electron hole are combined together in PN junction, they could turn electric energy into luminous energy directly. But not all the luminous energy can be sent to LED, some of the energy will be turned into heat in PN junction and silicone, which have huge bad effect on LED lighting. If LED does not transfer the heat effectively, the internal temperature will be increased. The more it increases, the lower luminous efficiency of LED is and the shorter it works. What's worse, it may lead LED chip to lose efficacy. Therefore, heat transfer is a big problem of
high-power LED lighting.

Thermal Interface Materials (TIMs) for Light Emitting DiodeThere is LED lighting's approach and steps to transfer heat. The routine of Heat flow is as follows: PN junction of LED - LED base - solder paste - deposited cooper layer - insulating layer - aluminium plate - Thermal Conductive Pad/ Grease - Aluminium heat dissipation -distributed in the air, which means the end of the heat conduction. LED base's Thermal conductivity is 80 W/mk, solder paste's is over 60 W/mk, deposited cooper layer's is about 400 W/mk, aluminium plate and Aluminium heat dissipation's is 200 W/mk, insulating layer's is IW/mk, and Thermal Conductive Pad/ Grease's is SW//mk. The closer to the LED's PN junction it is, the higher the heat density is. Thermal Conductive Pad/ Grease have an average temperature with the help of aluminium. Then the heat density of insulating layer is much higher than that of Thermal Conductive Pad/ Grease. As mentioned above, it is clear that the problem of heat transfer lies in the insulating layer of aluminium substrate.

So pls let us know the suitable thickness and dimension for the applied device!


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