Thermal Conductive Gap Fillers

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Router’s hardware includes: Storage, Power supply, Transmission media (Cable), CSU/DSU, Media of supplier, CPU, Connector and module.

To save cost and space, the volume of Router becomes smaller, in which case, heat dissipation become a big issue to technical engineers. When designing Routers, technical engineers replace heat sink, which covers a big area, with Thermal Conductive Gap Fillers and case to conduct heat so as to improve Router’s heat conduction and stability.

The following example explains how manufacturers use Thermal Conductive Gap Fillers to conduct heat when manufacturing Routers:
When producing Routers, certain manufacturer upends the PCB, placing the side with electronic components facing the bottom of shell. In this case, distance between electronic components and shell is very small. Original passive cooling is replaced by initiative cooling by replacing heat sink with Thermal Conductive Gap Fillers. By using Thermal Conductive Gap Fillers, heat is conducted to the outside case. It saves cost and save space.

How to choose suitable Thermal Conductive Gap Filler for the Routers?
First, measure the distance between electronic component and bottom of the shell of Router, and the size of heat generating power. Normally, Router’s heat generating power is electronic component, such as CPU, Storage. The size of electronic component decides the size of Thermal Conductive Gap Fillers. So far, TP080 and TP120 Thermal Conductive Gap Fillers are widely used in the design of Routers.

We appreciate the Router designer for advising reference information. Ask for samples of thermal conducive gap fillers, please call: +86-755-29765771 or email to

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