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-High thermal conductivity
-Low thermal resistance
-Low phase change temperature
-Electrical stability & High reliability
Applications:
These products are supplied on rolls with top tabbed liners for easy application and are clearly superior to thermal grease application. They also provide superior surface wetting, minimum bondlines thickness, and actively expel entrapped air. These products are used in various applications such as microprocessors, chipsets, and power components and modules.
-Memory module
-Micro processor unit
-Graphic processor unit
-Chipsets
Test Item |
Test Method |
Units |
Thermally Conductive Insulator Test Parameter |
|||
TC900S |
TC1200 |
TC2000 |
TCK10 |
|||
Color |
Visual |
--- |
Pink |
Black |
White |
Yellow |
Thickness |
ASTM D374 |
Mm |
0.23/0.3/0.45 |
0.23 |
0.25/0.45/0.5 |
0.152 |
Specific Gravity |
ASTM D792 |
g/cm3 |
1.7±0.1 |
1.7±0.1 |
1.7±0.1 |
1.7±0.1 |
Hardness |
ASTM D2240 |
Shore A |
90±5 |
80±5 |
90±5 |
90±5 |
Tensile Strength |
ASTM D412 |
kg/cm2 |
>34 |
>34 |
>34 |
>34 |
ASTM D412 |
pa |
9*106 |
9*106 |
9*106 |
3.4*107 |
|
Continuous use Temp |
--- |
℃ |
-50~+200 |
-50~+200 |
-50~+200 |
-50~+200 |
Elongation |
ASTM D412 |
% |
20 |
20 |
20 |
40 |
Voltage Endur Ance |
ASTM D149 |
KV/mm |
≥6.0 |
≥6.0 |
≥6.0 |
≥7.0 |
Flame Rating |
UL-94 |
--- |
V-0 |
V-0 |
V-0 |
V-0 |
Conductivity |
ASTM D5470 |
w/m.k |
1.6 |
1.8 |
3.5 |
1.3 |
-Low thermal resistance
-Low phase change temperature
-Electrical stability & High reliability
-Memory module
-Micro processor unit
-Graphic processor unit
-Chipsets