Dispensable, Very Low Compression Force 

The most commonly used interface material in the electronics cooling area, Thermal Gap Filler

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TG500 Series Thermal Conductive Grease
TG500
AOK
Thermal Grease/Thermal Gap Fillers
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Features: 
-Lowest thermal resistance
-High conformability and cost effective
-Long reliability
-Designed for easy application

Applications: 
- Between CPU,high performance GPU,IGBT and heatsink
- Telecom device, Military,Motol control Led lighting etc
- Cooling Module, memory module, in all applications where lower thermal resistance is required

 

Typical Properties of TG500 Series

Properties

Unit

Metric Value

Test Method

Color

---

Gray / pasty

Visual

Density

g/cc

2.85±0.1

ASTM  D374

Volume Impedance

ohm-cm

1.7*1016

ASTM D257

Thermal Resistance @50psi

℃-in2/W

0.06

ASTM D5470

Continuous Use Temp.

°C

-60-200°C

EN 344

UL, RoHS --- Compliance ---

Electrical

Dielectric Constant

1KHz

0.4

ASTM  D150

Flame rating




Thermal

Thermal Conductivity

W/m.k

5.0

ASTM D5470


 

Standard Container:

1 KG / Container; 2KG / Container; Special spec. available

Aochuan Technology offers many other thermal interface materials that may not be shown on our web site. Please go to Contact Form to receive a recommendation from our office on your specific application.


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