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TJ3020 and TJ3080 series thermal conductive glue are one component glue, are applied in the firm tack conjunction between the electronic components and other device materials. It is in speedy consolidation under normal temperature with superior tacky, exceptional electrical isolation, splendid seal and remarkable heat dissipation performance, which also is durable among the temperature from -60Celsius to 250 Celsius.
Main Characteristcs
- In one component neutral consolidation performance, it is highly performed elastomer by vulcanization, which is through the condensation function with water molecules in air.
- It has superior thermal conductive performance, which swiftly tansmit the heat from the heat source as to exceptionally cool down the heat source temperature.
- It has excellent thermal conductive glue performance on most matal and non-metal materials with superior seal-tack&thermal conductive performance fo miscellaneous electronic components.
- It satisfies with EU ROHS Directive.
Typical Properties of TJ3020/3080 Series Thermal Conductive Glue
Properties |
TJ3020 |
TJ3080 |
TEST METHOD |
Appearance |
White&Paste |
White&Paste |
Visual |
Tack Free Time(min) |
2-10 | 2-10 |
Stopwatch |
Tensile Strength(Mpa) |
≥1.0 |
≥1.0 |
ASTM D412 |
Hardness(shore A) |
50 |
70 |
ASTM D2240 |
Elongation(%) |
64 |
64 |
ASTM D374 |
Continuous Use Temp(℃) |
-60to250 |
-60to250 |
EN344 |
Volume Impedance(Ω.cm |
2.0*1014 |
2.0*1014 |
ASTM D257 |
Splice Strength(Mpa) |
≥1.5 |
≥1.5 |
DSP |
Dielectric Constant(50Hz) |
4.0 |
4.0 |
ASTM D150 |
Thermal Conductivity(W/mk) |
0.9 |
1.2 |
ASTM D5470 |
The Materials Typical Applications:
- It is superior tack splice material for electronic componets, semiconductor and electronic devices, which has exceptional performance of the seal, conjunction, electrical isolation and thermal conductive characteristics.
- It is highly applied in the electronic device, power module and electrical thermal controller for the heat dissipation and conjunction with seal function, which also is used for splice isolation of PTC
- It is in exceptional suitability for higher requirement on thermal conductive materials with the requirement of splice with seal performance
Using Method:
should clean the surface needed to be spliced and sealed before smearing this thermal conductive glue on it or remarkable conjunction(the thickness no exceeding 6mm). This material is in 5-10 minutes for the tack free time and in complete consolidation character after twenty-four hours. After the operating is over, should instantly screw the cap for storing the unused glue in good seal. Pls cut the seal from where to squeeze the material out by hand-operating flexible pipe or assembled with glue extrusion machine to handle.