AOK thermal conductive silicone grease TG300 is high-performance, thermally conductive gap filling materials, mainly for the transmission interface between the electronic equipment and heat sink or product outer coving. Nice stickiness, flexible, good compression performance and excellent heat conductivity are designed, which make the products can discharge air from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect.

Aochuan Technology offers many other thermal interface materials that may not be shown on our web site. Please go to Contact Form to receive a recommendation from our office on your specific application.

Thermal  Compound Process and precautions:

Clean the surface to be coated to remove the oil contamination;
Uniformly extrude the heat conduction silicone grease to the surface;
Note that the coat of grease should be uniform;
Only a thin layer of grease is needed, a thicker layer do not provide high thermal conductivity.

It is usually used as the thermal conductive medium in electronic components to reduce the heat resistant of the contact surface, consequently reduce the temperature of the electric component.

TG300 Series is a thermally conductive grease compound designed for:

- Between CPU,high performance GPU,IGBT and heatsink
- Telecom device, Military,Motol control Led lighting etc
- Cooling Module, memory module, in all applications where lower thermal resistance is required

Know more about AOK™ TP Series thermal pad