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- TP100 Series Thermal Conductive Gap Pad
- TP100/H25-T05
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- Thermally Conductive Gap Filler/Thermal Pad
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Heat is thermal energy that is transferred between two bodies due to a difference in temperature. Thermal pad heat transfer is the process of increasing the kinetic energy of a material's particles from a material of high temperature to one of lower temperature. It can also be thought of in the opposite direction of cooling an object by slowing down its particles. In addition, the naturally tacky consistency of the material allows for fast and easy assembly without adhesive.
Questions you may have include:
- How is heat transferred thermal pad by conduction?
- What is convection?
- How heat is transferred thermal pad by radiation?
Blow the tables will help you find the thermal pad that best suits your application needs. The thermal pad interface materials selection guide and comparison tables:
|
AOK™ TP Series |
Color |
Thickness Range [inch/(mm)] |
Thermal Conductivity [W/mK] |
Hardness [Shore C] |
View Details |
| TP080 Series |
Gray |
0.01"(0.25)~0.20"(5.0) |
0.8 |
30 |
TP080 |
| TP100 Series |
Dark Blue |
0.01"(0.25)~0.20"(5.0) |
1.0 |
15±5 |
TP100 |
| UTP100 Series |
Brown-Red |
0.01"(0.25)~0.20"(5.0) |
1.0 |
10±5 |
UTP100 |
| TP120 Series |
Light-White |
0.02"(0.5)~0.20"(5.0) |
1.2 |
15 |
TP120 |
| TP150 Series |
Dark Gray |
0.02"(0.5)~0.20"(5.0) |
1.5 |
30±5 |
TP150 |
| TP200 Series |
Dark Gray |
0.02"(0.5)~0.20"(5.0) |
2.0 |
20±5 |
TP200 |
| TP250 Series |
Bright Yellow |
0.02"(0.5)~0.20"(5.0) |
2.5 |
25±5 |
TP250 |
| TP300 Series |
Bright Blue |
0.02"(0.5)~0.20"(5.0) |
3.0 |
25±5 |
TP300 |
| TP500 Series |
Gray Red |
0.02"(0.5)~0.20"(5.0) |
5.0 |
50 |
TP500 |
TP100 Series thermal pad designs below are detailed in their dimensional and performance characteristics.
Follow the general guidelines to determine the design characteristics most suitable for your application. See following pages for detailed characteristics.
Typical Materials Properties of TP100
|
Properties |
TP100-T025 |
TP100-T05 |
TP100-T10 |
TP100-T20 |
TP100-T30 |
TP100-T40 |
TEST METHOD |
|
Thickness(mm) |
0.25 |
0.5 |
1.0 |
2.0 |
3.0 |
4.0 |
ASTM D374 |
|
Composition |
Silicone& Ceramic | Silicone& Ceramic | Silicone& Ceramic | Silicone& Ceramic | Silicone& Ceramic | Silicone& Ceramic |
--- |
|
Color |
Dark Blue |
Dark Blue |
Dark Blue |
Dark Blue |
Dark Blue |
Dark Blue |
Visual |
|
Hardness(shore C) |
35 |
15±5 |
15±5 |
18±5 |
18±5 |
18±5 |
ASTM D2240 |
|
Dielectric Constant(@1MHz) |
2.3 |
2.3 |
2.3 |
2.3 |
2.3 |
2.3 |
ASTM D792 |
|
Tensile Strength(KN/m |
0.75 |
0.75 |
0.75 |
0.75 |
0.75 |
0.75 |
ASTM D412 |
|
Elongation(%) |
90 |
90 |
90 |
90 |
90 |
90 |
ASTM D374 |
|
Continuous Use Temp(℃) |
-40to150 |
-40to150 |
-40to150 |
-40to150 |
-40to150 |
-40to150 |
EN344 |
|
Breakdown Voltage(Kv) |
>4.0 |
5.5 |
7 |
>7 |
>7 |
>7 |
ASTM D149 |
|
Volume Impedance(Ω.cm） |
1.5*1016 |
1.5*1016 |
1.5*1016 |
1.5*1016 |
1.5*1016 |
1.5*1016 |
ASTM D257 |
|
Dielectric Constant(@1MHz) |
3.0 |
4.87 |
4.87 |
4.87 |
4.87 |
4.87 |
ASTM D150 |
|
Weight Loss(%) |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
@200℃240H |
|
Flame Rating |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
Ul94 |
|
Thermal Conductivity(W/mk) |
1.0 |
1.0 |
1.0 |
1.0 |
1.0 |
1.0 |
ASTM D5470 |
UL, RoHS, REACH
Sheet sizes:
Standard sheet size:200*400mm；Custom Die-cut parts available；Available with or without PSA on reinforced side
TP100 Series is recommended for applications with operational temperatures between -40°C and +150°C and can be ordered in convenient pre-cut sheets up to a maximum size of 200mm x 400mm.
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
