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TP 200 series materials combines good thermal conductivity of 2.0 W/m-K with high compressibility to produce low thermal resistance.
Features:
-High thermal conductivity 2.0
-Good conformability and cost effective
-Naturally tacky
-Electrically insulating
-Meets UL 94 V0 rating, stable from -40°C to 150°C
Applications:
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
TP 200 Series Thermal Gap Filler is naturally tacky, requiring no adhesive coating to inhabit thermal performance, It can also be with a rubber-coated fiberglass carrier becoming one side tacky and no tacky on other side to allowing easy material handing and installation. These specialty pads offer improved shielding over regular type pads. They help prevent device malfunctions caused by electromagnetic noise, these incredibly soft and flexible pads are highly conformable for more efficient heat transfer.
AOK™ TP Series |
Color |
Thickness Range [inch/(mm)] |
Thermal Conductivity [W/mK] |
Hardness [Shore C] |
View Details |
TP080 Series |
Gray |
0.01"(0.25)~0.20"(5.0) |
0.8 |
30 |
TP080 |
TP100 Series |
Dark Blue |
0.01"(0.25)~0.20"(5.0) |
1.0 |
15±5 |
TP100 |
UTP100 Series |
Brown-Red |
0.01"(0.25)~0.20"(5.0) |
1.0 |
10±5 |
UTP100 |
TP120 Series |
Light-White |
0.02"(0.5)~0.20"(5.0) |
1.2 |
15 |
TP120 |
TP150 Series |
Dark Gray |
0.02"(0.5)~0.20"(5.0) |
1.5 |
30±5 |
TP150 |
TP200 Series |
Dark Gray |
0.02"(0.5)~0.20"(5.0) |
2.0 |
20±5 |
TP200 |
TP250 Series |
Bright Yellow |
0.02"(0.5)~0.20"(5.0) |
2.5 |
25±5 |
TP250 |
TP300 Series |
Bright Blue |
0.02"(0.5)~0.20"(5.0) |
3.0 |
25±5 |
TP300 |
TP500 Series |
Gray Red |
0.02"(0.5)~0.20"(5.0) |
5.0 |
50 |
TP500 |
Typical Properties of TP200
Properties |
TP200FG-T025 |
TP200-T05 |
TP200-T10 |
TP200-T20 |
TP200-T30 |
TP200-T40 |
TEST METHOD |
Thickness(mm) |
0.25 |
0.5 |
1.0 |
2.0 |
3.0 |
4.0 |
ASTM D374 |
Composition |
Silicone& Ceramic | Silicone& Ceramic | Silicone& Ceramic | Silicone& Ceramic | Silicone& Ceramic | Silicone& Ceramic |
--- |
Color |
Dark Gray |
Dark Gray |
Dark Gray |
Dark Gray |
Dark Gray |
Dark Gray |
Visual |
Hardness(shore C) |
30±5 |
25±5 |
25±5 |
25±5 |
25±5 |
25±5 |
ASTM D2240 |
Density(g/cm3) |
2.79 |
2.79 |
2.79 |
2.79 |
2.79 |
2.79 |
ASTM D792 |
Tensile Strength(KN/m |
0.61 |
1.65 |
1.65 |
1.65 |
1.65 |
1.65 |
ASTM D412 |
Elongation(%) |
90 |
90 |
90 |
90 |
90 |
90 |
ASTM D374 |
Continuous Use Temp(℃) |
-40to150 |
-40to150 |
-40to150 |
-40to150 |
-40to150 |
-40to150 |
EN344 |
Breakdown Voltage(Kv) |
5.1 |
7.0 |
7.0 |
>7.0 |
>7.0 |
>7.0 |
ASTM D149 |
Volume Impedance(Ω.cm) |
6*1012 |
6*1012 |
6*1012 |
6*1012 |
6*1012 |
6*1012 |
ASTM D257 |
Dielectric Constant(@1MHz) |
3.8 |
4.5 |
4.5 |
4.5 |
4.5 |
4.5 |
ASTM D150 |
Weight Loss(%) |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
@200℃240H |
Flame Rating |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
UL 94 |
Thermal Conductivity(W/mk) |
2.0 |
2.0 |
2.0 |
2.0 |
2.0 |
2.0 |
ASTM D5470 |
Let us show you the most important application fields:
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.