Support Service
Thermal
Environmental Policies 
- TP120 Series Thermal Conductive Gap Pad
- TP120/H25-T05
- AOK
- Thermally Conductive Gap Filler/Thermal Pad
- Main Page
- Specifications
- Item Application
- Downloads
TP120 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications. With a thermal conductivity of 1.2 W/m-K, low thermal resistances can be achieved at low pressures. TP120 is offered with a hard, metallized liner option for easy handling and improved rework. This metallized liner offers better thermal transfer than other silicone based liners found on comparable products. The metallized liner's lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.
Material Features:
-Good thermal conductivity
-Extremely soft and cost effective
-Naturally tacky
-Electrically insulating
Material Applications:
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink
|
AOK™ TP Series |
Color |
Thickness Range [inch/(mm)] |
Thermal Conductivity [W/mK] |
Hardness [Shore C] |
View Details |
| TP080 Series |
Gray |
0.01"(0.25)~0.20"(5.0) |
0.8 |
30 |
TP080 |
| TP100 Series |
Dark Blue |
0.01"(0.25)~0.20"(5.0) |
1.0 |
15±5 |
TP100 |
| UTP100 Series |
Brown-Red |
0.01"(0.25)~0.20"(5.0) |
1.0 |
10±5 |
UTP100 |
| TP120 Series |
Light-White |
0.02"(0.5)~0.20"(5.0) |
1.2 |
15 |
TP120 |
| TP150 Series |
Dark Gray |
0.02"(0.5)~0.20"(5.0) |
1.5 |
30±5 |
TP150 |
| TP200 Series |
Dark Gray |
0.02"(0.5)~0.20"(5.0) |
2.0 |
20±5 |
TP200 |
| TP250 Series |
Bright Yellow |
0.02"(0.5)~0.20"(5.0) |
2.5 |
25±5 |
TP250 |
| TP300 Series |
Bright Blue |
0.02"(0.5)~0.20"(5.0) |
3.0 |
25±5 |
TP300 |
| TP500 Series |
Gray Red |
0.02"(0.5)~0.20"(5.0) |
5.0 |
50 |
TP500 |
Technical specifications:
Typical Properties of TP120
|
Properties |
TP120-T025 |
TP120-T05 |
TP120-T10 |
TP120-T20 |
TP120-T30 |
TP120-T40 |
TEST METHOD |
|
Thickness(mm) |
0.25 |
0.5 |
1.0 |
2.0 |
3.0 |
4.0 |
ASTM D374 |
|
Composition |
Silicone& Ceramic |
Silicone& Ceramic |
Silicone& Ceramic |
Silicone& Ceramic |
Silicone& Ceramic |
Silicone& Ceramic |
--- |
|
Color |
Pink |
Pink |
Pink |
Pink |
Pink |
Pink |
Visual |
|
Hardness(shore C) |
35 |
15±5 |
15±5 |
15±5 |
15±5 |
15±5 |
ASTM D2240 |
|
Dielectric Constant(@1MHz) |
2.3 |
2.3 |
2.3 |
2.3 |
2.3 |
2.3 |
ASTM D792 |
|
Tensile Strength(KN/m |
1.2 |
1.0 |
1.0 |
1.0 |
1.0 |
1.0 |
ASTM D412 |
|
Elongation(%) |
50 |
50 |
50 |
50 |
50 |
50 |
ASTM D374 |
|
Continuous Use Temp(℃) |
-40to150 |
-40to150 |
-40to150 |
-40to150 |
-40to150 |
-40to150 |
EN344 |
|
Breakdown Voltage(Kv) |
5.5 |
7 |
7 |
7 |
7 |
7 |
ASTM D149 |
|
Volume Impedance(Ω.cm） |
1.5*1016 |
1.5*1016 |
1.5*1016 |
1.5*1016 |
1.5*1016 |
1.5*1016 |
ASTM D257 |
|
Dielectric Constant(@1MHz) |
3.50 |
5.0 |
5.0 |
5.0 |
5.0 |
5.0 |
ASTM D150 |
|
Weight Loss(%) |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
<0.5 |
@200℃240H |
|
Flame Rating |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
Ul94 |
|
Thermal Conductivity(W/mk) |
1.2 |
1.2 |
1.2 |
1.2 |
1.2 |
1.2 |
ASTM D5470 |
UL, RoHS, REACH
Sheet sizes:
Standard sheet size:200*400mm；Custom Die-cut parts available；Available with or without PSA on reinforced side
1. Insulation, thermal conductivity, wear resistance, flame retardant, filling gaps, resistance to compression, buffering and so on.
2. Products are free to sticky, you can choose different colors
3. Common Specifications: 200mm * 400mm, 100*100mm, 100mm*200mm, 300mm*300mm
4. Non-toxic substances, in line with ROHS requirements
For applications requiring gap filling and superior thermal performance without bonding. Provides IC package and PCB thermal interfacing with heat sinks or other cooling devices, and metal cases.
Blow The Main Applications:
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink
