TP300 Series Thermally Conductive Gap Filler is a specially designed cushion sheet with high thermal conductivity and reliable restoration properties. This special pad prevents damages and chipping or shorts and fits on all Chips without a protective frame with an open Core. The special feature of this pad is that it additionally features great thermal conductivity unlike other protective pads.

Features and Benefits

Dual layer of silicone, one on each side of polymer carrier
Excellent heat stability
Various thickness availability
Dust Free (No contamination)
High mechanical properties (high tear strength)
Naturally tacky requiring no additional adhesive coating
Excellent electrical insulation properties, Electrical non-conductivity prevents shorts

 
Our customers are responsible for the testing of materials quoted and assurance that the materials purchased are fit for their proposed use. Any information furnished by Aochuan Technology Co., Ltd regarding technical data is believed to be accurate and reliable but the customer bears the responsibility in assessing fitness for purpose. Aochuan Technology makes no warranties as to the fitness, merchantability or suitability of any materials or products for any specific or general uses. It's naturally tacky and does not need an additional adhesive coating that can inhibit thermal performance.

Aochuan Technology Co., Ltd shall not be liable for incidental or consequential damages of any kind. All products are sold pursuant to the Aochuan Technology terms and conditions of sale in effect at the time of delivery.  

Typical Properties of TP300

In some specialized applications where heat is generated from various height components and there is a high need to dissipated the heat to a heat-sink or an external metal casing, this type of thermally conductive gap pad are specially designed for such applications.

They are gel-like compounds that form sheets of 0.05 mm to 0.5 mm or thicker that can be placed and compressed to shape with the components. One side of these thermal gap pads is typically dry and non-tacky to facilitate servicing.

These gap filler pads help eliminate air gaps between components and the heat-sink while conforming to the curvature and warp of matching surfaces. They are soft and easily of compressible to the different heights of multiple components and remain stress free with outstanding mechanical shock absorption.

Typical application:
  -between the Circuit board chip and heat sink of LCD-TV
  -PDP chip and IC 
  -between the transformer and the shell.
  -between Led particle base and aluminum plate 
  -between PCB board and its shell
  -between IC and heat sink 
  -laptop NB display card and network card
  -between STB IC and heat sink or shell

TP300 Material Safety Data Sheet(MSDS)

TP300 SGS Test Report 2011